TI expands space-grade product portfolio with radiation-hardened and radiation-tolerant plastic packages for missions from new space to deep space
TI expands space-grade product portfolio with radiation-hardened and radiation-tolerant plastic packages for missions from new space to deep space
Staff
Tue, 11/29/2022 - 18:29
Engineers can use new ADCs and power semiconductors to increase thermal efficiency and reduce system size and weight while meeting radiation and reliability requirements
[original story: Circuit Digest]