New Rugged and Reliable Devices in Miniature DFN Packaging with Side-Wettable Flanks
New Rugged and Reliable Devices in Miniature DFN Packaging with Side-Wettable Flanks
Lakshita Khanna
Thu, 04/28/2022 - 16:47
Nexperia has announced its latest product additions to a growing range of discrete devices which are available in leadless DFN packages with side-wettable flanks (SWF). These space-saving and rugged components help satisfy the needs of next generation applications in smart and electric vehicles. Leadless DFN packages are up to 90% smaller than SOT23 packages and this helps to reduce the amount of board space required for the rapidly increasing number of electronic components being used in the latest vehicles.
[original story: Circuit Digest]