Congatec Introduces Ultra-Rugged 13th Gen Intel Core Modules for Extreme Environments
Congatec Introduces Ultra-Rugged 13th Gen Intel Core Modules for Extreme Environments
Staff
Thu, 11/16/2023 - 12:47
Congatec, a leader in embedded and edge computing technology, has launched a new series of ultra-rugged COM Express Compact Computer-on-Modules. These modules are powered by the 13th Gen Intel Core processors and are distinguished by their extreme ruggedness, capable of operating in harsh temperature ranges from -40°C to +85°C. These new CoM’s are specifically designed for challenging environments, featuring soldered RAM for enhanced shock and vibration resistance, complying with stringent railway standards.
[original story: Circuit Digest]